Different Thinking to Move Forward, Functional Pastes
作为一种高科技环保材料，主要用于面向未来的 IT 设备、工业设备和汽车电装等精密和创新行业。凭借昌星功能性浆料的可靠性和高效性，我们实现了第n次工业革命的高科技材料梦想。
功能性浆料一般是由功能性填充物、粘合剂和溶剂均匀分散并具有流动性的复合材料。功能性填充物根据浆料的用途金属、陶瓷、碳等, 粘合剂根据基板种类和热处理温度使用玻璃粉(glass frits)、高分子树脂(Polymer resin)等。根据印刷(Printing)、浸渍(Dipping)、点胶(Dispensing)等应用工艺调整流变性能, 从而赋予功能性浆料的可加工性。
应用领域- ∙ IT设备、汽车电装和家用电器的零件
- - 贴片元件
- : 贴片电感/MLCC/贴片压敏电阻
- - 柔性电路
- : 薄膜/RFID标签/触摸屏
- - PCB 应用
- : PCB 通孔/柔性 PCB
- - 电子陶瓷
- : 压电元件/微波
- - 电子控制装置
- : 功率模块、热电模块
- - 绝缘包覆
芯片元件
昌星的芯片元件用浆料，通过针对不同基材优化的收缩率和印刷形状控制，提供均一的品质和优异的芯片特性。
芯片元件(内电极)用
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L69 | Ag | 850-900℃ | 200-300 | ㆍAg 82%, 88%, 90% ㆍExcellent line resolution |
| Paron-L80 | Ag | 850-900℃ | 200-300 | ㆍAg 82%, 85% ㆍHigh sintering density |
| Paron-L10 | Ag | 850-900℃ | 200-300 | ㆍAg 85%, 88% ㆍSlow sintering |
| Paron-L90 | Ag | 850-900℃ | 250-350 | ㆍFine line (30um) |
| Paron-L20 | Ag | 600-850℃ | 200-300 | ㆍL20A : High shrinkage |
| Paron-V10 | Pd | 1,100-1,300℃ | 50 | ㆍHigh reliability |
| Paron-V22 | Ag/Pd=8/2 | 850-1,050℃ | 35 | ㆍElectrical property control, Low cost |
| Paron-V23 | Ag/Pd=7/3 | 950-1,100℃ | 30 | ㆍElectrical property control |
| Paron-P30 | Ag95/Pd5 | 850-910℃ | 30-50 | ㆍMLPZT : Excellent sheet matching |
芯片元件(外电极)用
| Product No. | Filler | Firing/ Curing conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L65A | Ag | 650-800℃ | 30-40 | ㆍAg 50% ㆍThin thickness, Low Ag |
| Paron-L65B | 650~700℃ | 30~40 | ㆍAg 65% ㆍUniform shape, dense sintered structure |
|
| Paron-L65E | 800~850℃ | 50~60 | ㆍAg 65% ㆍLow viscosity, high temp. |
|
| Paron-C77A1 | Cu | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 |
| Paron-C77A2 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77B0 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0402 | |
| Paron-C77B1 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-C77B2 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77H1 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-E10 | Ag | 150~200℃/30~60min. | 20~60 | ㆍSoft termination |
| Paron-E30 | Cu | 150~200℃/30~60min.(N2) | 20~40 | ㆍSoft termination (Low cost) |
电子元件(PTC/PZT/NTC)用
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-P11 | Ag/Zn | 580-630℃ | 180-210 | ㆍPTC : Ohmic Paste |
| Paron-P12 | Ag | 580-630℃ | 180-210 | ㆍPTC : Cover Paste |
| Paron-P10 | Al | 760-830℃ | 36-44 | ㆍPTC : Al electrode Paste |
| Paron-P96 | Ag | 750-850℃ | 100 | ㆍPZT, NTC (PbO free & Pb) |
| Paron-W38 | Ag | 800-850℃ | 200 | ㆍExcellent solderability, adhesion (for ceramic substrate) |
| Paron-W51 | Ag | 800-850℃ | 200 | ㆍAg paste for AlN substrate |
| Paron-W50 | Ag | 800-850℃ | 200 | ㆍAg paste for Al203 substrate |
LTCC/HTCC用
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L15N | Ag | 850-900℃ | 200-220 | ㆍInner paste for LTCC |
| Paron-L15G | Ag | 850-900℃ | 240-280 | ㆍGround paste for LTCC |
| Paron-L15V | Ag | 850-900℃ | 220-260 | ㆍVia paste for LTCC |
| Paron-L15T | Ag | 850-900℃ | 4-6 | ㆍThru paste for LTCC (Low viscosity) |
| Paron-MP2 series | Mo | 1,300-1,500℃ | 160-240 | ㆍPattern paste |
| Paron-MV1 | Mo | 1,300-1,500℃ | 220-260 | ㆍVia fill paste |
| Paron-H10 | W | 1,300-1,500℃ | 380-460 | ㆍPattern paste |
| Paron-H12 | W | 1,300-1,500℃ | 13-17 | ㆍVia fill paste |
基板材料
昌星的陶瓷基板用浆料，基于均一的印刷与贴附特性，提供高散热特性与可靠性。
AMB(Active Metal Brazing)/TPC(Thick Printed Copper)用
| Product No. | Process | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-990M | Brazing | Vacuum brazing | 100-200 | ㆍActive metal brazing ㆍVoid free ㆍLow thickness |
| Paron-D10 | Printing | Requires inert sintering | 280-320 | ㆍThick printed copper (For attaching ceramic substrates) |
| Paron-D20 | Printing | 250-290 | ㆍThick printed copper (For building up pattern) |
|
| Paron-D30 | Printing | 110-140 | ㆍThick printed copper (For protective coating) |
Die/Module Attach用
| Product No. | Filler | Pattern Size | Sintering | Process | thermal conductivity | Bonding interface |
|---|---|---|---|---|---|---|
| ParonTAC® W20 | Ag : 78% | < 300 mm² | Pressure |
200 ~ 250℃ > 9 MPa, > 3 min |
> 200 W/mK | Ag, Cu, Au |
| ParonTAC® W25 | Ag : 85% | Pressure | > 200 W/mK | Ag, Cu, Au | ||
| ParonTAC® W40 | AgCu | Pressure | > 150 W/mK | Ag, Au | ||
| ParonTAC® W30 | Ag | - | Pressure-less | 200℃, > 1hr | > 150 W/mK | Ag, Cu, Au |
发热体用
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-W41 | Ag | > 750℃ | 100 | ㆍGlass/Ceramic substrate, Screen printing ㆍHeating element paste |
| Paron-H86 | Ag | 550 ± 20℃ | 100 | ㆍEHD printing (For attaching glass substrates) ㆍFine patterning ㆍGood jetting stability |
| Paron-H87 | Ag | 750 ± 20℃ | 200 | ㆍEHD printing (For attaching glass substrates) ㆍFine patterning ㆍGood jetting stability |
Glass密封及保护用
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| ParonTAC®G10 | Glass | > 350℃ | 70 | ㆍSealing paste |
| ParonTAC®G20 | Glass | > 700℃ | 100 | ㆍOverGlaze paste (Pb, Pb free) |
柔性电路
昌星的柔性电路用浆料，基于独步独创的材料技术，针对优异的印刷特性、导电性以及绝缘性提供解决方案。
薄膜开关用
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-910 Series | Ag | 130°C/30~60min | 15-50 | 15-25 | ㆍLow resistivity |
| Paron-962 Series | 150°C/30~60min | 10-20 | 15-25 | ㆍHalogen free, Low resistivity | |
| Paron-960 Series | 140°C/30~60min | 15-20 | 10-20 | ㆍHalogen free, Excellent flexibility | |
| Paron-950 Series | 80°C/30~60min | 15-30 | 15-30 | ㆍLow temperature curing | |
| Paron-951 Series | 90°C/30~60min | 20-40 | 5-20 | ㆍHalogen free, Low temperature curing | |
| Paron-930 | Ag+C | 130°C/30~60min | 40 | 12-16 | ㆍCarbon blended, Low cost |
| Paron-920 | C | 15,000 | 15-25 | ㆍFlexible carbon paste | |
| Paron-921 | 15,000 | 20-30 | ㆍHalogen free, Flexible carbon paste |
PCBㆍFPCB用
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-611 Series | Ag | 150°C/30-60min | 25-50 | 20-30 | ㆍHigh reliability, Low resistivity |
| Paron-621 | Ag (Ag/Cu) |
50°C, 70°C, 150°C /each 30min |
200 | 6 | ㆍHigh reliability, Low resistivity |
| Paron-650N | 6 | ㆍLow cost |
触摸屏电极用
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Fine line width(㎛) | Comments |
|---|---|---|---|---|---|---|
| Paron-810 Series | Ag | 130°C/20min | ≤ 20 | 150~200 | ≥ 80 | ㆍScreen printing type |
| Paron-811 Series | Ag | 130°C/20min | ≤ 20 | 50~100 | 15~20 | ㆍLaser etching type |
| Paron-813 Series | Ag/Cu | 130°C/10min | ≤ 35 | 150~200 | ≥ 100 | ㆍScreen printing type (Low cost) |
电路绝缘用
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|---|
| Paron-310 | Resin | 300 ~ 600 mJ/cm² | 1010 | 15 | ㆍGreen color |
| Paron-310T | 500 ~ 1,000 mJ/cm² | 1010 | 40 | ㆍColorless & Transparency |
芯片绝缘用
| Product No. | Base | Curing Conditions | Type | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|---|
| Paron-C32 | Epoxy | 200℃ / 1hr | Standard | 70-100 | ㆍChip component insulation ㆍGood adhesion(Ceramic, Metal) |
| Paron-C33 | Epoxy | 200℃ / 1hr | Solvent Free | 70-100 | ㆍChip component insulation ㆍGood adhesion(Ceramic, Metal) ㆍSolvent Free |
