Different Thinking to Move Forward, Functional Pastes
Chang Sung’s conductive pastes are advanced eco-friendly materials widely used in innovative precision industries, such as future-oriented IT devices, industrial devices, and automotive electrical and electronic components. Propelled by the advantages of reliability and high efficiency, CSC conductive pastes realize the dream of high-tech materials envisaging the next industrial revolution.
Functional pastes are composite materials with high flowability in which functional fillers, binders, and solvents are uniformly distributed. Metallic, ceramic, or carbon materials are selected as functional fillers depending on what the paste is used for. Glass frits or polymer resins are used as binders according to the substrate type and heat treatment temperature. The workability of the paste is determined based on the applied processes, which affect its fluid properties, such as printing, dipping, and dispensing.
Application- ∙ IT devices, automotive electrical and electronic components, and home appliance parts
- - Chip Components
- : Chip Inductors, MLCC, Chip Varistors
- - Flexible Circuits
- : Membrane Touch Switches, RFID Tag Antennas, Touch Screen Electrodes
- - PCB Applications
- : PCB Through-Holes, Flexible Printed Circuit Boards
- - Electronic Ceramics
- : Piezo / Microwave Products
- - Electronic Control Unit
- : Power Module, Thermoelectric Module
- - Insulation Coating
Chip Components
CSC's Chip component pastes provide consistent quality and excellent chip characteristics through substrate-optimized shrinkage rates and precise print shape control.
Chip Components (Internal Electrode)
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L69 | Ag | 850-900℃ | 200-300 | ㆍAg 82%, 88%, 90% ㆍExcellent line resolution |
| Paron-L80 | Ag | 850-900℃ | 200-300 | ㆍAg 82%, 85% ㆍHigh sintering density |
| Paron-L10 | Ag | 850-900℃ | 200-300 | ㆍAg 85%, 88% ㆍSlow sintering |
| Paron-L90 | Ag | 850-900℃ | 250-350 | ㆍFine line (30um) |
| Paron-L20 | Ag | 600-850℃ | 200-300 | ㆍL20A : High shrinkage |
| Paron-V10 | Pd | 1,100-1,300℃ | 50 | ㆍHigh reliability |
| Paron-V22 | Ag/Pd=8/2 | 850-1,050℃ | 35 | ㆍElectrical property control, Low cost |
| Paron-V23 | Ag/Pd=7/3 | 950-1,100℃ | 30 | ㆍElectrical property control |
| Paron-P30 | Ag95/Pd5 | 850-910℃ | 30-50 | ㆍMLPZT : Excellent sheet matching |
Chip Components (External Electrode)
| Product No. | Filler | Firing/ Curing conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L65A | Ag | 650-800℃ | 30-40 | ㆍAg 50% ㆍThin thickness, Low Ag |
| Paron-L65B | 650~700℃ | 30~40 | ㆍAg 65% ㆍUniform shape, dense sintered structure |
|
| Paron-L65E | 800~850℃ | 50~60 | ㆍAg 65% ㆍLow viscosity, high temp. |
|
| Paron-C77A1 | Cu | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 |
| Paron-C77A2 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77B0 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0402 | |
| Paron-C77B1 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-C77B2 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77H1 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-E10 | Ag | 150~200℃/30~60min. | 20~60 | ㆍSoft termination |
| Paron-E30 | Cu | 150~200℃/30~60min.(N2) | 20~40 | ㆍSoft termination (Low cost) |
Electronic components(PTC/PZT/NTC)
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-P11 | Ag/Zn | 580-630℃ | 180-210 | ㆍPTC : Ohmic Paste |
| Paron-P12 | Ag | 580-630℃ | 180-210 | ㆍPTC : Cover Paste |
| Paron-P10 | Al | 760-830℃ | 36-44 | ㆍPTC : Al electrode Paste |
| Paron-P96 | Ag | 750-850℃ | 100 | ㆍPZT, NTC (PbO free & Pb) |
| Paron-W38 | Ag | 800-850℃ | 200 | ㆍExcellent solderability, adhesion (for ceramic substrate) |
| Paron-W51 | Ag | 800-850℃ | 200 | ㆍAg paste for AlN substrate |
| Paron-W50 | Ag | 800-850℃ | 200 | ㆍAg paste for Al203 substrate |
LTCC/HTCC
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L15N | Ag | 850-900℃ | 200-220 | ㆍInner paste for LTCC |
| Paron-L15G | Ag | 850-900℃ | 240-280 | ㆍGround paste for LTCC |
| Paron-L15V | Ag | 850-900℃ | 220-260 | ㆍVia paste for LTCC |
| Paron-L15T | Ag | 850-900℃ | 4-6 | ㆍThru paste for LTCC (Low viscosity) |
| Paron-MP2 series | Mo | 1,300-1,500℃ | 160-240 | ㆍPattern paste |
| Paron-MV1 | Mo | 1,300-1,500℃ | 220-260 | ㆍVia fill paste |
| Paron-H10 | W | 1,300-1,500℃ | 380-460 | ㆍPattern paste |
| Paron-H12 | W | 1,300-1,500℃ | 13-17 | ㆍVia fill paste |
Ceramic Substrates
CSC's Ceramic Substrate pastes provide high thermal dissipation properties and reliability based on uniform printing and excellent adhesion characteristics.
AMB(Active Metal Brazing)/TPC(Thick Printed Copper)
| Product No. | Process | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-990M | Brazing | Vacuum brazing | 100-200 | ㆍActive metal brazing ㆍVoid free ㆍLow thickness |
| Paron-D10 | Printing | Requires inert sintering | 280-320 | ㆍThick printed copper (For attaching ceramic substrates) |
| Paron-D20 | Printing | 250-290 | ㆍThick printed copper (For building up pattern) |
|
| Paron-D30 | Printing | 110-140 | ㆍThick printed copper (For protective coating) |
Die/Module Attach
| Product No. | Filler | Pattern Size | Sintering | Process | thermal conductivity | Bonding interface |
|---|---|---|---|---|---|---|
| ParonTAC® W20 | Ag : 78% | < 300 mm² | Pressure |
200 ~ 250℃ > 9 MPa, > 3 min |
> 200 W/mK | Ag, Cu, Au |
| ParonTAC® W25 | Ag : 85% | Pressure | > 200 W/mK | Ag, Cu, Au | ||
| ParonTAC® W40 | AgCu | Pressure | > 150 W/mK | Ag, Au | ||
| ParonTAC® W30 | Ag | - | Pressure-less | 200℃, > 1hr | > 150 W/mK | Ag, Cu, Au |
Heating Elements
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-W41 | Ag | > 750℃ | 100 | ㆍGlass/Ceramic substrate, Screen printing ㆍHeating element paste |
| Paron-H86 | Ag | 550 ± 20℃ | 100 | ㆍEHD printing (For attaching glass substrates) ㆍFine patterning ㆍGood jetting stability |
| Paron-H87 | Ag | 750 ± 20℃ | 200 | ㆍEHD printing (For attaching glass substrates) ㆍFine patterning ㆍGood jetting stability |
Glass Sealing & Protection
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| ParonTAC®G10 | Glass | > 350℃ | 70 | ㆍSealing paste |
| ParonTAC®G20 | Glass | > 700℃ | 100 | ㆍOverGlaze paste (Pb, Pb free) |
Flexible Circuit
CSC's Flexible Circuit pastes provide solutions for excellent printing characteristics, conductivity, and insulation, powered by our unique materials technology.
Membrane Touch Switches
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-910 Series | Ag | 130°C/30~60min | 15-50 | 15-25 | ㆍLow resistivity |
| Paron-962 Series | 150°C/30~60min | 10-20 | 15-25 | ㆍHalogen free, Low resistivity | |
| Paron-960 Series | 140°C/30~60min | 15-20 | 10-20 | ㆍHalogen free, Excellent flexibility | |
| Paron-950 Series | 80°C/30~60min | 15-30 | 15-30 | ㆍLow temperature curing | |
| Paron-951 Series | 90°C/30~60min | 20-40 | 5-20 | ㆍHalogen free, Low temperature curing | |
| Paron-930 | Ag+C | 130°C/30~60min | 40 | 12-16 | ㆍCarbon blended, Low cost |
| Paron-920 | C | 15,000 | 15-25 | ㆍFlexible carbon paste | |
| Paron-921 | 15,000 | 20-30 | ㆍHalogen free, Flexible carbon paste |
PCBㆍFPCB
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-611 Series | Ag | 150°C/30-60min | 25-50 | 20-30 | ㆍHigh reliability, Low resistivity |
| Paron-621 | Ag (Ag/Cu) |
50°C, 70°C, 150°C /each 30min |
200 | 6 | ㆍHigh reliability, Low resistivity |
| Paron-650N | 6 | ㆍLow cost |
Touch Screen
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Fine line width(㎛) | Comments |
|---|---|---|---|---|---|---|
| Paron-810 Series | Ag | 130°C/20min | ≤ 20 | 150~200 | ≥ 80 | ㆍScreen printing type |
| Paron-811 Series | Ag | 130°C/20min | ≤ 20 | 50~100 | 15~20 | ㆍLaser etching type |
| Paron-813 Series | Ag/Cu | 130°C/10min | ≤ 35 | 150~200 | ≥ 100 | ㆍScreen printing type (Low cost) |
Circuit insulation coating
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|---|
| Paron-310 | Resin | 300 ~ 600 mJ/cm² | 1010 | 15 | ㆍGreen color |
| Paron-310T | 500 ~ 1,000 mJ/cm² | 1010 | 40 | ㆍColorless & Transparency |
Chip insulation coating
| Product No. | Base | Curing Conditions | Type | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|---|
| Paron-C32 | Epoxy | 200℃ / 1hr | Standard | 70-100 | ㆍChip component insulation ㆍGood adhesion(Ceramic, Metal) |
| Paron-C33 | Epoxy | 200℃ / 1hr | Solvent Free | 70-100 | ㆍChip component insulation ㆍGood adhesion(Ceramic, Metal) ㆍSolvent Free |
